アクア静止型洗浄・乾燥装置
  製品の特徴
The high aspect (1:50) device products can not be applicapable for trench/via hole clean/dry by the
Conventional Clean method, but our unique technology can realize the ultra-small (10nm~)clean/dry effectively.
Complete DIW replacement at trench/via hole can be done by pressured/de-pressed atmosphere at closed chamber after IPA process.
After DIW replacement, Vacuum atmosphere will be break down by N2 and complete drying can be N2, process materialized.
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